applications video on-demand isdn telecom interface sts-1 interfaces lan interconnects isdn u-interfaces 10/100 ethernet iec compatibility iec61000-4-2 (esd) 15kv (air), 8kv (contact) iec61000-4-4 (eft) 40a (5/50 s) iec61000-4-5 (lightning) 24a (8/20 s) low capacitance tvs diode array so-08 pin configuration features 800 watts peak pulse power per line (tp=8/20 s) protects two lines in common and differential mod e low capacitance for high-speed interfaces low clamping and operating voltage rohs compliant mechanical characteristics jedec so-08 package molding compound flammability rating : ul 94v-o weight 70 millgrams (approximate) quantity per reel : 500pcs reel size : 7 inch lead finish : lead free pin configuration esd/t e sd** ser ies 0 1 | www.spsemi.cn rev.2014.05.01
(v) (v) @1a ( a) (pf) (max.) (min.) (ma) (max.) (max.) (@a) (max.) (max.) 25 39 20 1 15 sm8 lc15 15 16,7 1 19 33 25 1 15 sm8 lc12 12 13.3 1 20 45 50 15 sm8 lc05 5 6.0 1 10 24 37 10 15 TESD05K4U sm8 lc03 3 4.5 1 7 storage temperature range t stg -55 ~ 150 units peak pulse power (tp=8/20s waveform) t j -55 ~ 150 maximum ratings (@ 25 unless otherwise specified) lead soldering temperature operating temperature range v c i t t l 260 (10 sec.) device characteristics v b part number device marking v rwm symbol value p pp electrical characteristics per line (@ 25 unless otherwise specified) v c i r c t 800 watts parameter 53 72 10 1 15 sm8 lc36 36 40.0 1 40 57 15 1 15 sm8 lc24 24 26.7 1 25 39 20 1 15 lc15 15 16,7 1 esd/t e sd** ser ies tesd03k4u tesd12k4u tesd15k4u tesd24k4u tesd36k4u 0 2 | www.spsemi.cn rev.2014.05.01
* soldering footprint sop-08 package outline & dimensions * soldering footprint esd/t e sd** ser ies rev.2014.05.01 03| www.spsemi.cn
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